Notes
Outline
"Welcome to the online mini..."
    Welcome to the online mini virtual tour for the Integrated Technology Division & PCB Fabrication facilities.
   You can start the tour & advanced the slides
   by either hitting the “SPACE BAR” or “LEFT”
   clicking on the mouse. Please click on the
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"Chandler,"
 Chandler, Arizona
 Tour Menu
Integrated Technologies Division
Process Capabilities
PCB Manufacturing Division
Click on a Link to view a specific area of interest then “Left” click the mouse to advance to the next slide.
Integrated Technologies Division
Assembly Pre-Production Engineering
Design Rules Check and Capabilities Review
Process Route Generation
Machine Programming
Assembly Tooling Design
Stencil Design
New Process Development
Integrated Technologies Capabilities
SMT
Wave Soldering
IPC Certified Hand Soldering
Custom Component Installation
Hardware Installation
Card Cage and Chassis Assembly
Electro Mechanical Assembly
Cable and Harness Assembly
Backpanel Press-Fit Assembly
ICT, Functional, ESS Testing
Integrated Technologies Division
Integrated Technologies Division
 MPM AP-36  Screen Printer
* Fully Automated with Vision
*28 x 28 Printable Area
*Fine Pitch Capable
Integrated Technologies Division
Fuji SMT Line
Integrated Technologies Division
MyData MY12 SMT Placement
*Prototype and/or Large Board Capability
Integrated Technologies Division
* Box Build Assembly and Staging Area
Integrated Technologies Division
 Bare Board Assembly
* Complete Box Build Integration
Integrated Technologies Division
*Soltec-Wave Solder  *3 Zone bottom heat
*Pulse top heat  *Lambda and  Chip Wave
Integrated Technologies Division
*GPD Aqueous Wash
*Complete DI Water System - Closed Loop
PCB Manufacturing Capabilities
High Temperature FR4 > 170 Tg
Getek / FR408 / Polyimide / Rogers Series
Copper Foil - HTE 1/8 oz. - 4 oz.
Buried / Blind Vias
Electroless Nickel Immersion Gold
Hard Gold
Soft Bondable Gold
Entek 106A
Hot Air Solder Leveling (SMOBC)
Silver Immersion
Cam / Programming
* Valor ODB++ Software
* Sun Sparc Ultra 7 & 10 Workstations
* Customer Data Reviewed & Prepared for Fab
Inner Layer Dryfilm Coat
* Dupont Automated Cut Sheet Laminator
Conveyorized D.E.S. Line
* Develop ---> Etch ---> Strip ---> Durabond
Inner Layer Optical Inspection
* New Camtech AOI Machines Capable of     
  Comparing Scanned Image to Supplied Gerber
(AOI – Automated Optical Inspection)
   TMP Hydraulic / Vacuum Assist       
 Lamination Presses
* Computer Controlled / Pre-Set Lamination Cycles
Pluritec Inspecta X-ray Vision System
*Confirms Internal Registration
 *Drills “New” Tooling Holes as Required
Slide 21
PENC Electroless Copper Plating Line
* Computer Controlled - Increased Productivity
* Agitation - Vibrator for High Aspect Ratio PCB’s
* Bumper - for Copper Process Only
Automated PAL Plating Line
*11 Acid Copper Plating Stations
*Twin Rectifier Units Per Station
* Automated Twin Hoist / High Repeatability
Solder Mask
* DP-10 & DP-100 Auto-Screeners
* Tack Dry* UV Expose
Micro - Plate Line
* Hard Gold & Nickel Plating of Edge Connectors
Fabrication
* Routing of Individual PCB’s - Single up or Array Format  
* Edge Beveling & Scoring
*Secondary Drilling as Required
Electrical Test
Everett Charles 9090 Tester
100% Netlist Testing
Dual Access / Clamshell Test
A Winning Combination
Commitment to On-Time Deliveries
Technical Expertise and Support
Vertical Integration
Team Selling and Engineering
Commitment to Quality