PC BOARD ASSEMBLY CAPABILITIES
Mixed Technologies Assembly Placement – SMT and Through-Hole for Printed Circuit Boards and Circuit Card Assemblies
Surface Mount Technology (SMT) / Surface Mount Devices (SMDs) Single or Double Sided – Down to 0201 Packages – Fine Pitch down to .3mm and smaller with engineering review.
BGAs (Ball Grid Arrays) Micro-BGA – High Density Interconnections (HDI)
Automated mounting of SMD components
RoHS and/or Lead Finishes (Lead and Lead-Free Soldering)
Conformal Coating & Potting
Backplane – Backpanel Specialist
Through-Hole devices (PTH) wave or hand soldering
SMT reflow and/or wave soldering
Quad-Flat Pack IC, Leadless Chip Carriers/CSP, and Custom Components
Automatic Optical Inspection (AOI)
Automated Solder Paste Application
Complete Electronic or Mechanical Assembly & Box Builds
Test Solutions include:
Automated Optical Inspection (AOI)
In-Circuit Test
- Reliability test (Hi-pot, vibration, burn in, high and low temperature test)
- Firmware programming
- Analogue & digital functional test
- Design For Test (DFT) Processes
- BGA X-Ray Evaluation
- Functional Testing
- Framescan
Component and Process Traceability
Workmanship to IPC-A-610
CERTIFIED IS09001
SBC is an ISO 9001:2015 certified company through UL-DQS. South Bay Circuits utilizes ISO 9001:2015 eight fundamental quality management principles to help improve our PC Board Fab, PC Assembly, and Box Build performance. Certificate #: 10000903 QM15
ITAR REGISTRATION
ITAR Registered & CMMC Level 1! We are a manufacturer that builds defense articles with related technical data that can be defined on the United States Munitions List (Part 121 of the ITAR), where we are registered and meets the reqirements of CMMC Level 1.

