PC BOARD ASSEMBLY CAPABILITIES
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Mixed Technologies Assembly Placement – SMT and Through-Hole for Printed Circuit Boards and Circuit Card Assemblies
Surface Mount Technology (SMT) / Surface Mount Devices (SMDs) Single or Double Sided – Down to 0201 Packages – Fine Pitch down to .3mm and smaller with engineering review.
BGAs (Ball Grid Arrays) Micro-BGA – High Density Interconnections (HDI)
Automated mounting of SMD components
RoHS and/or Lead Finishes (Lead and Lead-Free Soldering)
Conformal Coating & Potting
Backplane – Backpanel Specialist
Through-Hole devices (PTH) wave or hand soldering
SMT reflow and/or wave soldering
Quad-Flat Pack IC, Leadless Chip Carriers/CSP, and Custom Components
Automatic Optical Inspection (AOI)
Automated Solder Paste Application
Complete Electronic or Mechanical Assembly & Box Builds
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Test Solutions include:
Automated Optical Inspection (AOI)
In-Circuit Test
- Reliability test (Hi-pot, vibration, burn in, high and low temperature test)
- Firmware programming
- Analogue & digital functional test
- Design For Test (DFT) Processes
- BGA X-Ray Evaluation
- Functional Testing
- Framescan
Component and Process Traceability
Workmanship to IPC-A-610
CERTIFIED IS09001
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SBC is an ISO 9001:2015 certified company through UL-DQS. South Bay Circuits utilizes ISO 9001:2015 eight fundamental quality management principles to help improve our PC Board Fab, PC Assembly, and Box Build performance. Certificate #: 10000903 QM15
ITAR REGISTRATION
![ITAR-Reg](https://sbcinc.com/wp-content/uploads/2021/05/ITAR-Reg.jpg)
ITAR Registered! We are a manufacturer that builds defense articles with related technical data that can be defined on the United States Munitions List (Part 121 of the ITAR), where we are registered.