PC BOARD MANUFACTRUING CAPABILITIES ROADMAP
South Bay Circuits offers flexible and far reaching technologies to our customers. Below details our PC Board Manufacturing Capabilities Roadmap. It presents a technology road map to consider when creating Designs and Printed Circuit Board Layouts. Further consider that Technologies may be available but each comes with relative availability, reliability, quality, and cost factors. Standard is most cost effective and readily available. Advanced is also readily available at a higher cost level than Standard. Innovative are technologies that are developing. Certainly availability may be limited and cost is significantly higher than Standard technologies.
TECHNOLOGY / PROCESSES |
STANDARD |
ADVANCED |
INNOVATIVE |
|---|---|---|---|
| Circuit Layers | 0 – 20 | 20 + | 30 + |
| Circuit Trace/Space (External with 1/2 Oz Cu) | .004″/.004″ | .003″/.003″ | .002″/.002″ |
| Circuit Trace/Space (Internal with 1 Oz Cu) | .004″/.004″ | .003″/.003″ | .002″/.002″ |
| Circuit Trace/Space (2 Oz Cu) | .010″/.010″ | .008″/.008″ | .007″/.007” |
| Preferred Copper Foil Starting Weight | 1/2 OZ | – | – |
| Maximum Starting Weight Before Plating (Cu Foil) | 3 OZ | – | – |
| Minimum Board Thickness | .025″ | .020″ | .018″ |
| Minimum Finished Core Thickness | .004″ | .003″ | .002″ |
| Pre-Preg Tolerance | +/-.003” | +/-.002” | +/-.002” |
| Min Drilled Hole Thickness (.062” Finished Thickness) | .010″ | .008″ | .007″ |
| Min Drilled Hole Edge to Drilled Hole Edge | .010” | .010” | .010” |
| Blind Vias | Yes | Yes | Yes |
| Micro Vias | No | Limited | Yes |
| Microvia Hole Diameter | .006″ | .004″ | .004″ |
| Buried Vias | Yes | Yes | Yes |
| Sequential Lamination | Yes | Yes | Yes |
| Hole Aspect Ratio | 10:1 | 14:1 | 16:1 |
| BGA Package Size | 0.5mm | 0.4mm | < 0.4mm |
| SMOBC – Tin/Lead Finish | 63/37 SnPb | – | – |
| Lead-Free Surface Finish | Yes | Yes | Yes |
| ENIG (Electroless/Immersion Gold) | Yes | Yes | Yes |
| Immersion Silver Finish | Yes | Yes | Yes |
| Gold Body | Yes | Yes | Yes |
| Gold Fingers | Yes | Yes | Yes |
| Edge Plating | Yes | Yes | Yes |
| Liquid Photoimageable (LPI) Solder Mask Registration | .003” | .002” | .002” |
| LPI Solder Mask Dams between SMT Pads Spacing | .010” | .007” | .007” |
| Via Capping Only – Dry Film Solder Mask (Conformask) | Yes | Yes | Yes |
| Controlled Impedance | Yes | Yes | Yes |
| Via Hole Plugging (non-conductive) | Yes | Yes | Yes |
| Impedance Control | +/- 10% | +/- 7% | +/- 5% |
SBC Guidelines for PC Board Manufacturability (PDF)
Please contact us for further discussion or engineer review of your requirement regarding our PC Board Manufacturing Capabilities Roadmap.
CERTIFIED IS09001
SBC is an ISO 9001:2015 certified company through UL-DQS. South Bay Circuits utilizes ISO 9001:2015 eight fundamental quality management principles to help improve our PC Board Fab, PC Assembly, and Box Build performance. Certificate #: 10000903 QM15
ITAR REGISTRATION
ITAR Registered! We are a manufacturer that builds defense articles with related technical data that can be defined on the United States Munitions List (Part 121 of the ITAR), where we are registered.